I am just about to replace my mobo. The new one is an epox cu 133 and my processor is a pIII 1ghz. On removing the heatsink and processor from the old board there does not appear to be any compound on the surfaces. Question is do I need to apply compund to the heatsink or processor? In the manual it just says "note Intels reference design thermal solution is an active heatsink; an extruded aluminium heatsink based and a fan attached to the top on the fin array" but does not mention applying thermal compound anywhere.