Micron is offering a new 16Gb DRAM memory chip, billing it as the densest server-memory module on the market.

Micron said its memory module features 72 2Gb DDR2 (double data rate, second generation) dies that are packaged as 36 4Gb TwinDie components.

Micron said its proprietary TwinDie stacking technology offers fewer and shorter connection routes to the chips, which enables faster access to data in the memory. The retention, reliability and availability of data in computer memory concern enterprises that process large amounts of data, such as banks or shopping websites.

The 16Gb module offers twice the capacity of memory modules available today, said Kevin Kilbuck, senior manager of strategic marketing and product development at Micron. "We are ahead of the pack in terms of density," he said.

Micron's move is seen as an aggressive marketing ploy by Shane Rau, a chip industry analyst at IDC.

"It is in keeping with how server makers are keeping up with demand for memory," Rau said. The forecast for the average amount of memory capacity in mid-range servers shipped by the end of 2006 is 38GB, up 60 percent from an average 24GB in 2005, he said, citing IDC research.

While Micron's new module is the densest in the industry to date, Rau anticipated that it will be closely followed by competitors.

Micron's rivals in the memory module market include Qimonda, Hynix and Samsung.

Micron sells to server manufacturers. Some of Micron's customers are evaluating samples of the 16Gb memory modules and commercial availability of the product is slated for later this year, the company said.